31.180 : Printed circuits and boards
-
BS EN IEC 63203-402-2:2024
Wearable electronic devices and technologies Performance measurement of fitness wearables. Step counting
3/19/2024 - PDF - English - BSI
Learn More€250.00 -
BS IEC 62899-202-8:2024
Printed electronics Materials. Conductive ink. Measurement of difference in resistance printing direction conductive film fabricated with wire-shaped materials
3/19/2024 - PDF - English - BSI
Learn More€180.00 -
24/30488910 DC:2024
BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
3/11/2024 - PDF - English - BSI
Learn More€24.00 -
PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
2/7/2024 - PDF - English - BSI
Learn More€151.00 -
DIN EN IEC 61249-2-51:2024-02
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad (IEC 61249-2-51:2023), German version EN IEC 61249-2-51:2023
2/1/2024 - PDF - German - DIN
Learn More€92.62 -
IEC TS 62878-2-10:2024
IEC TS 62878-2-10:2024 Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
1/31/2024 - PDF - English - IEC
Learn More€46.00 -
24/30485597 DC:2024
BS IEC 62899-402-8. Printed electronics Part 402-8. Printability. Measurement of qualities. Shape pattern dimension
1/9/2024 - PDF - English - BSI
Learn More€24.00 -
PR NF IEC 62878-2-603, C93-778-2-603PR (01/2024)
Techniques d'assemblage avec appareil(s) intégré(s) - Partie 2-603 : lignes directrices pour un empilement de modules électroniques - Méthode d'essai de la connectivité électrique entre modules
1/1/2024 - Paper - English, French - AFNOR
Learn More€64.50 -
BS EN IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures assemblies Thermal conductivity test base materials
12/25/2023 - PDF - English - BSI
Learn More€180.00 -
BS EN IEC 61189-2-804:2023
Test methods for electrical materials, printed board and other interconnection structures assemblies time to delamination. T260, T288, T300
12/25/2023 - PDF - English - BSI
Learn More€151.00 -
BS EN IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
12/19/2023 - PDF - English - BSI
Learn More€250.00 -
NF EN IEC 63251, C93-737 (12/2023)
Méthode d'essai des propriétés mécaniques des circuits optoélectriques souples sous contrainte thermique
12/1/2023 - Paper - French - AFNOR
Learn More€93.50 -
DIN EN IEC 61189-2-501:2023-12
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022), German version EN IEC 61189-2-501:2022
12/1/2023 - PDF - German - DIN
Learn More€92.62 -
€330.00
-
€230.00
-
BS EN IEC 63203-401-1:2023
Wearable electronic devices and technologies Devices systems: functional elements. Evaluation method of the stretchable resistive strain sensor
11/30/2023 - PDF - English - BSI
Learn More€331.00 -
23/30483578 DC:2023
BS IEC 62899-202-11. Printed electronics Part 202-11. Materials. Conductive ink. Measurement method of electrical resistance uniformity for large area printed conductive layer
11/23/2023 - PDF - English - BSI
Learn More€24.00 -
€449.00
-
UNE-EN IEC 61189-2-804:2023
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (Endorsed by Asociación Española de Normalización in November of 2023.)
11/3/2023 - PDF - English - AENOR
Learn More€57.00 -
PR NF EN IEC 61188-6-3, C93-711-6-3PR (11/2023)
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-3 : Conception de la zone de report - Description de la zone de report pour les composants à trous traversants (THT)
11/1/2023 - Paper - English, French - AFNOR
Learn More€107.50 -
IEC 63251:2023
IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
11/1/2023 - PDF - English, French - IEC
Learn More€173.00 -
BS IEC 62899-202-9:2023
Printed electronics Materials. Conductive ink. patterns for mechanical test
10/26/2023 - PDF - English - BSI
Learn More€180.00 -
23/30436874 DC:2023
BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity
10/23/2023 - PDF - English - BSI
Learn More€24.00 -
IEC 63055:2023
IEC 63055:2023 Format for LSI-Package-Board Interoperable design
10/11/2023 - PDF - English - IEC
Learn More€489.00 -
UNE-EN IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (Endorsed by Asociación Española de Normalización in October of 2023.)
10/6/2023 - PDF - English - AENOR
Learn More€59.00 -
UNE-EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (Endorsed by Asociación Española de Normalización in October of 2023.)
10/6/2023 - PDF - English - AENOR
Learn More€57.00 -
NF EN IEC 61189-2-804, C93-732-804 (10/2023)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-804 : méthodes d'essai pour le temps de décollement interlaminaire - T260, T288, T300
10/1/2023 - Paper - French - AFNOR
Learn More€40.33 -
UNE-EN IEC 61249-6-3:2023
Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards (Endorsed by Asociación Española de Normalización in September of 2023.)
9/18/2023 - PDF - English - AENOR
Learn More€68.00 -
BS EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures assemblies Z-axis expansion of base materials
9/13/2023 - PDF - English - BSI
Learn More€151.00 -
23/30479769 DC:2023
BS EN IEC 61249-2-52 Materials for printed boards and other interconnecting structures Part 2-52. Reinforced base materials clad unclad. Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
9/12/2023 - PDF - English - BSI
Learn More€24.00 -
BS EN IEC 61249-6-3:2023 + Redline
Tracked Changes. Materials for printed boards and other interconnecting structures Sectional specification set reinforcement materials. Specification finished fabric woven from "E" glass
9/6/2023 - PDF - English - BSI
Learn More€326.00 -
NF EN IEC 61189-2-801, C93-732-801 (09/2023)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-801 : essai de conductivité thermique pour matériaux de base
9/1/2023 - Paper - French - AFNOR
Learn More€72.00 -
NF EN IEC 61189-2-803, C93-732-803 (09/2023)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-803 : méthodes d'essai pour la dilatation suivant l'axe Z des matériaux de base et des cartes imprimées
9/1/2023 - Paper - French - AFNOR
Learn More€72.00 -
IPC 6012F:2023
Qualification and Performance Specification for Rigid Printed Boards
9/1/2023 - Papier - English - IPC
Learn More€264.00 -
IPC 6012F:2023
Qualification and Performance Specification for Rigid Printed Boards
9/1/2023 - PDF sécurisé - English - IPC
Learn More€204.00 -
IEC 61189-2-804:2023
IEC 61189-2-804:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
8/25/2023 - PDF - English, French - IEC
Learn More€23.00 -
BS IEC 62899-202-10:2023
Printed electronics Materials. Resistance measurement method for thermoformable conducting layer
8/23/2023 - PDF - English - BSI
Learn More€250.00 -
IEC 62899-202-10:2023
IEC 62899-202-10:2023 Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
8/16/2023 - PDF - English - IEC
Learn More€219.00 -
BS EN IEC 61249-6-3:2023
Materials for printed boards and other interconnecting structures Sectional specification set reinforcement materials. Specification finished fabric woven from "E" glass
8/8/2023 - PDF - English - BSI
Learn More€250.00 -
IEC 62899-202-9:2023
IEC 62899-202-9:2023 Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
8/3/2023 - PDF - English - IEC
Learn More€92.00 -
23/30477815 DC:2023
BS IEC 62899-302-7. Printed electronics Part 302-7. Equipment. Measurement methods for Inkjet printing dot placement evaluation printed
8/2/2023 - PDF - English - BSI
Learn More€24.00 -
NF EN IEC 61249-6-3, C93-780-6-3 (08/2023)
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 6-3 : ensemble de spécifications intermédiaires pour matériaux de renfort - Spécification des tissus finis en verre "E" pour circuits imprimés
8/1/2023 - Paper - French - AFNOR
Learn More€88.33 -
UNE-EN IEC 61249-2-51:2023
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (Endorsed by Asociación Española de Normalización in July of 2023.)
7/26/2023 - PDF - English - AENOR
Learn More€65.00 -
IEC 61189-2-801:2023
IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
7/26/2023 - PDF - English, French - IEC
Learn More€46.00 -
IEC 61189-2-803:2023
IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
7/26/2023 - PDF - English, French - IEC
Learn More€23.00 -
DIN EN IEC 62878-2-603:2023-07
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022), Text in German and English
7/1/2023 - PDF - English, German - DIN
Learn More€79.72 -
CWA 18002:2023
Best practices for hybridization and injection moulding of rigid control units on in-mould flexible devices
6/22/2023 - PDF - English - NBN
Learn More€121.00 -
BS EN IEC 61249-2-51:2023
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Base materials integrated circuit card carrier tape, unclad
6/22/2023 - PDF - English - BSI
Learn More€180.00 -
PD IEC TR 61191-9:2023
Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit for use in automotive applications. Best practices
6/19/2023 - PDF - English - BSI
Learn More€377.00 -
IEC 61249-6-3:2023
IEC 61249-6-3:2023 Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
6/14/2023 - PDF - English, French - IEC
Learn More€173.00 -
BS IEC 62899-202:2023 + Redline
Tracked Changes. Printed electronics Materials. Conductive ink
6/8/2023 - PDF - English - BSI
Learn More€382.00 -
IEC TR 61191-9:2023
IEC TR 61191-9:2023 Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
6/7/2023 - PDF - English - IEC
Learn More€397.00 -
23/30474639 DC:2023
BS EN IEC 62899-402-1. Printed electronics Part 402-1. Printability. Measurement of qualities. Line pattern widths
6/2/2023 - PDF - English - BSI
Learn More€24.00 -
NF EN IEC 61249-2-51, C93-780-2-51 (06/2023)
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-51 : matériaux de base renforcés, plaqués et non plaqués - Matériaux de base pour bande support de carte à circuit intégré, non plaqués
6/1/2023 - Paper - French - AFNOR
Learn More€88.33 -
IEEE 2716:2022
IEEE Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding
5/29/2023 - PDF - English - IEEE
Learn More€66.00 -
IEEE 2716:2022
IEEE Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding
5/29/2023 - Paper - English - IEEE
Learn More€82.00 -
23/30473810 DC:2023
BS IEC 63240-1. Active assisted living (AAL) reference architecture and model Part 1. Reference
5/26/2023 - PDF - English - BSI
Learn More€24.00 -
23/30474274 DC:2023
BS EN IEC 63267-3-81. Fibre optic interconnecting devices and passive components. Connector optical interfaces for enhanced Macro bend multimode fibre Part 3-81. parameters of physically contacting 50 µm core diameter fibres. Non-angled polyphenylene sulphide rectangular ferrules with a single row 12, 8, 4, or 2 fibres reference connector applications
5/26/2023 - PDF - English - BSI
Learn More€24.00 -
23/30474278 DC:2023
BS EN IEC 63267-3-61. Fibre optic interconnecting devices and passive components. connector optical interfaces for enhanced macrobend multimode fibres Part 3-61. Connector parameters of physically contacting 50 µm core diameter fibres. Non-angled 2,5 mm 1,25 cylindrical full zirconia ferrules reference connection applications
5/26/2023 - PDF - English - BSI
Learn More€24.00 -
€293.00
-
IEC 61249-2-51:2023
IEC 61249-2-51:2023 Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
5/11/2023 - PDF - English, French - IEC
Learn More€132.00 -
IEC 62899-202:2023
IEC 62899-202:2023 Printed electronics - Part 202: Materials - Conductive ink
5/2/2023 - PDF - English - IEC
Learn More€270.00 -
IEC 62899-202:2023 + Redline
IEC 62899-202:2023 (Redline version) Printed electronics - Part 202: Materials - Conductive ink
5/2/2023 - PDF - English - IEC
Learn More€352.00 -
IPC 9797A:2023
Press-fit Standard for Automotive Requirements and other High-Reliability Applications
5/1/2023 - Papier - English - IPC
Learn More€242.00 -
IPC 9797A:2023
Press-fit Standard for Automotive Requirements and other High-Reliability Applications
5/1/2023 - PDF sécurisé - English - IPC
Learn More€182.00 -
PR NF EN IEC 61189-2-720, C93-732-720PR (04/2023)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-720 : détection de défauts présents dans les structures d'interconnexion par mesurage de la capacité
4/1/2023 - Paper - English, French - AFNOR
Learn More€64.50 -
PR NF EN IEC 61189-2-808, C93-732-808PR (04/2023)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures et assemblages d'interconnexion - Partie 2-808 : résistance thermique d'un assemblage par la méthode du transitoire thermique
4/1/2023 - Paper - English, French - AFNOR
Learn More€80.50 -
DIN EN IEC 61188-6-2:2023-03
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021), German version EN IEC 61188-6-2:2021
3/1/2023 - PDF - German - DIN
Learn More€110.00 -
BS EN IEC 63203-801-1:2022
Wearable electronic devices and technologies Smart body area network (SmartBAN). Enhanced ultra-low power physical layer
2/7/2023 - PDF - English - BSI
Learn More€180.00 -
BS EN IEC 62496-2-5:2022
Optical circuit boards. Basic test and measurement procedures Flexibility for flexible opto-electric circuits
1/26/2023 - PDF - English - BSI
Learn More€250.00 -
BS EN IEC 63203-402-1:2022
Wearable electronic devices and technologies Performance measurement of fitness wearables. Test methods glove-type motion sensors for measuring finger movements
1/20/2023 - PDF - English - BSI
Learn More€250.00 -
23/30445197 DC:2023
BS EN 62899-401. Printed electronics Part 401. Printability. Overview
1/16/2023 - PDF - English - BSI
Learn More€24.00 -
DIN EN IEC 61189-2-807:2023-01
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021), German version EN IEC 61189-2-807:2021
1/1/2023 - PDF - German - DIN
Learn More€72.80 -
22/30453836 DC:2022
BS EN 60194-2. Printed boards design, manufacture and assembly. Vocabulary Part 2. Common usage in electronic technologies as well printed board assembly
12/16/2022 - PDF - English - BSI
Learn More€24.00 -
DIN EN IEC 61189-5-601:2022-12
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 61189-5-601:2021), German version EN IEC 61189-5-601:2021
12/1/2022 - PDF - German - DIN
Learn More€131.96 -
UNE-EN IEC 62496-2-5:2023
Optical circuit boards - Basic test and measurement procedures - Part 2-5: Flexibility test for flexible opto-electric circuits (Endorsed by Asociación Española de Normalización in March of 2023.)
10/12/2022 - PDF - English - AENOR
Learn More€69.00 -
PR NF EN IEC 61189-2-809, C93-732-809PR (10/2022)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-809 : Essai du coefficient de dilatation thermique (CTE) X/Y pour matériaux de base épais à l'aide d'un analyseur thermomécanique (TMA)
10/1/2022 - Paper - English, French - AFNOR
Learn More€56.00 -
€194.00
-
PD IEC PAS 61191-10:2022
Printed board assemblies Application and utilization of protective coatings for electronic
9/13/2022 - PDF - English - BSI
Learn More€449.00 -
DIN EN IEC 61189-2-720:2022-09
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 91/1786/CD:2022), Text in German and English
9/1/2022 - PDF - English, German - DIN
Learn More€65.89 -
PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic industries
8/23/2022 - PDF - English - BSI
Learn More€180.00 -
DIN EN IEC 61189-5-301:2022-08
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (IEC 61189-5-301:2021), German version EN IEC 61189-5-301:2021
8/1/2022 - PDF - German - DIN
Learn More€120.84 -
DIN EN IEC 61189-5-501:2022-08
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (IEC 61189-5-501:2021), German version EN IEC 61189-5-501:2021
8/1/2022 - PDF - German - DIN
Learn More€104.95 -
DIN EN IEC 62878-2-602:2022-08
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 62878-2-602:2021), German version EN IEC 62878-2-602:2021
8/1/2022 - PDF - German - DIN
Learn More€79.72 -
DIN EN IEC 61188-6-1:2022-08
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021), German version EN IEC 61188-6-1:2021.
8/1/2022 - PDF - German - DIN
Learn More€115.33 -
IEC PAS 61191-10:2022
IEC PAS 61191-10:2022 Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
7/18/2022 - PDF - English - IEC
Learn More€489.00 -
22/30442107 DC:2022
Printed Electronics Part 507-1. Quality assessment. electrode and rivet connection to wire terminal
6/17/2022 - PDF - English - BSI
Learn More€24.00 -
BS EN IEC 63203-406-1:2022
Wearable electronic devices and technologies Test method for measuring surface temperature of wrist-worn wearable while in contact with human skin (IEC 63203-406-1:2021)
5/10/2022 - PDF - English - BSI
Learn More€180.00 -
BS EN IEC 61189-2-501:2022
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Measurement of resilience strength retention factor flexible dielectric
5/6/2022 - PDF - English - BSI
Learn More€250.00 -
DIN EN IEC 61189-5-502:2022-05
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021), German version EN IEC 61189-5-502:2021
5/1/2022 - PDF - German - DIN
Learn More€104.95 -
22/30455094 DC:2022
BS EN 61189-2-720. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-720. Detection of defects in by measurement capacitance
4/30/2022 - PDF - English - BSI
Learn More€24.00 -
IEC TR 62878-2-9:2022
IEC TR 62878-2-9:2022 Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
4/27/2022 - PDF - English - IEC
Learn More€92.00 -
BS IEC 62899-201-2:2021
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates
4/6/2022 - PDF - English - BSI
Learn More€151.00 -
DIN EN IEC 61188-6-3:2022-04
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021), Text in German and English
4/1/2022 - PDF - English, German - DIN
Learn More€99.35 -
UNE-EN IEC 61189-2-501:2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (Endorsed by Asociación Española de Normalización in April of 2022.)
4/1/2022 - PDF - English - AENOR
Learn More€65.00 -
ASTM D3380-22
Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
3/15/2022 - PDF - English - ASTM
Learn More€57.00 -
ASTM D3380-22 + Redline
Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
3/15/2022 - PDF - English - ASTM
Learn More€68.00 -
NF EN IEC 61189-2-501, C93-732-501 (03/2022)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-501 : méthodes d'essai des matériaux pour structures d'interconnexion - Mesure de la puissance élastique et du facteur de rétention de la puissance élastique des matériaux diélectriques flexibles
3/1/2022 - Paper - French - AFNOR
Learn More€88.33 -
DIN EN IEC 61189-2-805:2022-03
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020), Text in German and English
3/1/2022 - PDF - English, German - DIN
Learn More€59.63 -
DIN EN IEC 61189-2-808:2022-03
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020), Text in German and English
3/1/2022 - PDF - English, German - DIN
Learn More€92.62 -
DIN EN IEC 61189-2-809:2022-03
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021), Text in German and English
3/1/2022 - PDF - English, German - DIN
Learn More€59.63 -
€183.00
-
€243.00
-
IPC 6012E-AM1:2022
IPC-6012E-AM1: Qualification and Performance Specification for Rigid Printed Boards
3/1/2022 - PDF sécurisé - English - IPC
Learn More€24.00 -
IEC 61189-2-501:2022
IEC 61189-2-501:2022 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
2/3/2022 - PDF - English, French - IEC
Learn More€92.00 -
IPC 6018D:2022
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
2/1/2022 - PDF sécurisé - English - IPC
Learn More€195.00 -
PR NF EN IEC 61189-2-805, C93-732-805PR (01/2022)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-805 : essai à faible CDT X/Y par TMA pour matériaux de base minces
1/1/2022 - Paper - English, French - AFNOR
Learn More€56.00 -
IPC-QRG-DRM-PTH - Revision H - Training & Reference Guide
Through-Hole Solder Joint Evaluation Training & Reference Guide - English
1/1/2022 - Paper - English - IPC
Learn More€107.00 -
IPC-QRG-SMT - Revision H - Training & Reference Guide
Surface Mount Solder Joint Evaluation Training & Reference Guide -English
1/1/2022 - Paper - English - IPC
Learn More€106.80 -
IPC 4202C:2022
Specification for Flexible Base Dielectrics for Use in Flexible Printed Boards
1/1/2022 - PDF sécurisé - English - IPC
Learn More€100.00 -
IPC 4202C:2022
Specification for Flexible Base Dielectrics for Use in Flexible Printed Boards
1/1/2022 - Paper - English - IPC
Learn More€142.00 -
BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
12/24/2021 - PDF - English - BSI
Learn More€250.00 -
21/30434810 DC:2021
BS EN IEC 62899-202-8. Printed electronics Part 202-8. Materials. Conductive film. Measurement for difference in resistance with printing direction of conductive film fabricated wire shaped materials
12/17/2021 - PDF - English - BSI
Learn More€24.00 -
21/30432230 DC:2021
BS EN IEC 63203-402-3. Wearable electronic devices and technologies Part 402-3. Performance measurement method of wearables. Series 2: Accuracy Heart Rate Determination
11/19/2021 - PDF - English - BSI
Learn More€24.00 -
21/30447898 DC:2021
BS EN IEC 63203-402-2. Wearable electronic devices and technologies Part 402-2. Performance Measurement of Fitness Wearables. Step Counting
11/19/2021 - PDF - English - BSI
Learn More€24.00 -
BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Decomposition temperature (Td) using TGA
11/5/2021 - PDF - English - BSI
Learn More€151.00 -
21/30437997 DC:2021
BS EN IEC 62899-202-10. Printed Electronics Part 202-10. Materials. Resistance measurement method for thermoformable conducting layers
11/5/2021 - PDF - English - BSI
Learn More€24.00 -
UNE-EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (Endorsed by Asociación Española de Normalización in November of 2021.)
11/1/2021 - PDF - English - AENOR
Learn More€60.00 -
PD IEC TR 62899-402-4:2021
Printed electronics Printability. Measurement of qualities. Classification and measurement methods for morphology
10/29/2021 - PDF - English - BSI
Learn More€180.00 -
21/30446636 DC:2021
BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-808. Thermal resistance of an assembly by thermal transient method
10/29/2021 - PDF - English - BSI
Learn More€24.00 -
IEC 62899-202-4:2021
IEC 62899-202-4:2021 Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)
10/22/2021 - PDF - English - IEC
Learn More€173.00 -
IEC 62899-201-2:2021
IEC 62899-201-2:2021 Printed electronics - Part 201-2: Materials - Substrates - Measurement methods for properties of stretchable substrates
10/14/2021 - PDF - English - IEC
Learn More€46.00 -
DIN EN IEC 62878-1:2021-10
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019), German version EN IEC 62878-1:2019
10/1/2021 - PDF - German - DIN
Learn More€99.35 -
UNE-EN IEC 62878-2-602:2021
Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (Endorsed by Asociación Española de Normalización in October of 2021.)
10/1/2021 - PDF - English - AENOR
Learn More€63.00 -
NF EN IEC 61189-2-807, C93-732-807 (10/2021)
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807 : Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA
10/1/2021 - Paper - French - AFNOR
Learn More€72.00 -
IPC 6012EA:2021
Automotive Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
10/1/2021 - PDF sécurisé - English - IPC
Learn More€58.00 -
IEC TR 62899-402-4:2021
IEC TR 62899-402-4:2021 Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology
9/21/2021 - PDF - English - IEC
Learn More€132.00 -
IEC 61189-2-807:2021
IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
9/3/2021 - PDF - English, French - IEC
Learn More€46.00 -
IPC 6013E:2021
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
9/1/2021 - PDF sécurisé - English - IPC
Learn More€195.00 -
DIN EN IEC 61189-5-504:2021-09
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (IEC 61189-5-504:2020), German version EN IEC 61189-5-504:2020
9/1/2021 - PDF - German - DIN
Learn More€104.95 -
BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
8/20/2021 - PDF - English - BSI
Learn More€180.00 -
NF EN IEC 62878-2-602, C93-778-2-602 (08/2021)
Techniques d'assemblage avec appareil(s) intégré(s) - Partie 2-602 : lignes directrices pour un empilement de modules électroniques - Méthode d'évaluation de la connectivité électrique entre modules
8/1/2021 - Paper - French - AFNOR
Learn More€88.33 -
21/30441791 DC:2021
BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-809. X/Y Coefficient of Thermal Expansion (CTE) Thick Base Materials by TMA
7/30/2021 - PDF - English - BSI
Learn More€24.00 -
PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
7/29/2021 - PDF - English - BSI
Learn More€180.00 -
IPC 4552B:2021
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
7/27/2021 - PDF sécurisé - English - IPC
Learn More€231.00 -
IEC TR 62878-2-8:2021
IEC TR 62878-2-8:2021 Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
7/7/2021 - PDF - English - IEC
Learn More€92.00 -
IEC 62878-2-602:2021
IEC 62878-2-602:2021 Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
6/22/2021 - PDF - English, French - IEC
Learn More€92.00 -
NF EN IEC 61189-5-601, C93-735-601 (06/2021)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601 : general test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards - Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-601 : méthodes d'essai générales pour les matériaux et les assemblages - Essai d'aptitude au brasage par refusion pour un joint brasé, et essai de résistance
6/1/2021 - Paper - French - AFNOR
Learn More€127.67 -
NF EN IEC 61189-5-502, C93-735-502 (06/2021)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502 : General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies - Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-502 : Méthodes d'essai générales pour les matériaux et les ensembles - Essai de résistance d'isolement de surface (SIR) des ensembles.
6/1/2021 - Paper - French - AFNOR
Learn More€103.33 -
UNE-EN IEC 61189-5-301:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (Endorsed by Asociación Española de Normalización in June of 2021.)
6/1/2021 - PDF - English - AENOR
Learn More€75.00 -
BS EN IEC 61189-5-301:2021
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Soldering paste using fine solder particles
5/6/2021 - PDF - English - BSI
Learn More€293.00 -
UNE-EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)
5/1/2021 - PDF - English - AENOR
Learn More€75.00 -
BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
4/22/2021 - PDF - English - BSI
Learn More€180.00 -
BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design use Land pattern design. Generic requirements for land on
4/7/2021 - PDF - English - BSI
Learn More€293.00 -
IEC 62899-402-3:2021
IEC 62899-402-3:2021 Printed electronics - Part 402-3: Printability - Measurement of qualities - Voids in printed pattern using a two-dimensional optical image
4/7/2021 - PDF - English - IEC
Learn More€132.00 -
NF EN IEC 61188-6-1, C93-711-6-1 (04/2021)
Circuit boards and circuit board assemblies - Design and use - Part 6-1 : land pattern design - Generic requirements for land pattern on circuit boards - Cartes à circuit imprimé et cartes à circuit imprimé équipées - Conception et utilisation - Partie 6-1 : Conception de la zone de report - Exigences génériques pour la zone de report sur les cartes à circuit imprimé
4/1/2021 - Paper - French - AFNOR
Learn More€116.33 -
NF EN IEC 61189-5-301, C93-735-301 (04/2021)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301 : general test methods for materials and assemblies - Soldering paste using fine solder particles - Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-301 : Méthodes d'essai pour les cartes imprimées équipées - Pâte à braser à fines particules de brasage.
4/1/2021 - Paper - French - AFNOR
Learn More€116.33 -
DIN EN IEC 62878-2-5:2021-04
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (IEC 62878-2-5:2019), German version EN IEC 62878-2-5:2019
4/1/2021 - PDF - German - DIN
Learn More€148.04 -
UNE-EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (Endorsed by Asociación Española de Normalización in April of 2021.)
4/1/2021 - PDF - English - AENOR
Learn More€69.00 -
UNE-EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (Endorsed by Asociación Española de Normalización in April of 2021.)
4/1/2021 - PDF - English - AENOR
Learn More€72.00 -
UNE-EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (Endorsed by Asociación Española de Normalización in April of 2021.)
4/1/2021 - PDF - English - AENOR
Learn More€71.00 -
UNE-EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (Endorsed by Asociación Española de Normalización in April of 2021.)
4/1/2021 - PDF - English - AENOR
Learn More€83.00 -
PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed for use automotive electronic control units. Best practices
3/25/2021 - PDF - English - BSI
Learn More€293.00 -
BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Reflow soldering ability solder joint, reflow heat resistance
3/19/2021 - PDF - English - BSI
Learn More€331.00 -
BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for the most common surface mounted components (SMD)
3/19/2021 - PDF - English - BSI
Learn More€250.00 -
IEC TR 61191-8:2021
IEC TR 61191-8:2021 Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
3/19/2021 - PDF - English - IEC
Learn More€270.00 -
BS EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures assemblies General test materials assemblies. Surface insulation resistance (SIR) testing of
3/18/2021 - PDF - English - BSI
Learn More€250.00 -
IEC 61189-5-301:2021
IEC 61189-5-301:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
3/17/2021 - PDF - English, French - IEC
Learn More€270.00 -
BS EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Surface insulation resistance (SIR) testing of solder fluxes
3/12/2021 - PDF - English - BSI
Learn More€250.00 -
BS IEC 62899-202-7:2021
Printed electronics Materials. film. Measurement of peel strength for printed layer on flexible substrate by the 90° method
3/11/2021 - PDF - English - BSI
Learn More€180.00 -
IEC 62899-202-7:2021
IEC 62899-202-7:2021 Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method
3/3/2021 - PDF - English - IEC
Learn More€92.00 -
NF EN IEC 61189-5-501, C93-735-501 (03/2021)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-501 : méthodes d'essai générales pour les matériaux et les ensembles - Essais de résistance d'isolement en surface (RIS) des flux de brasage
3/1/2021 - Paper - French - AFNOR
Learn More€103.33 -
NF EN IEC 61188-6-2, C93-711-6-2 (03/2021)
Printed boards and printed board assemblies - Design and use - Part 6-2 : land pattern design - Description of land pattern for the most common surface mounted components (SMD) - Cartes à circuit imprimé et cartes à circuit imprimé équipées - Conception et utilisation - Partie 6-2 : conception de la zone de report - Description de la zone de report pour les composants montés en surface (CMS) les plus courants
3/1/2021 - Paper - French - AFNOR
Learn More€88.33 -
IEC 61188-6-1:2021
IEC 61188-6-1:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
2/23/2021 - PDF - English, French - IEC
Learn More€270.00 -
IEC 60194-1:2021
IEC 60194-1:2021 Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
2/9/2021 - PDF - English, French - IEC
Learn More€489.00 -
IEC 61188-6-2:2021
IEC 61188-6-2:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
2/4/2021 - PDF - English, French - IEC
Learn More€173.00 -
IEC 61189-5-502:2021
IEC 61189-5-502:2021 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies
2/3/2021 - PDF - English, French - IEC
Learn More€173.00 -
IEC 61189-5-601:2021
IEC 61189-5-601:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
2/3/2021 - PDF - English, French - IEC
Learn More€270.00 -
IEC 61189-5-501:2021
IEC 61189-5-501:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
1/26/2021 - PDF - English, French - IEC
Learn More€132.00 -
PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design use 3D shape data for CAD component library
1/22/2021 - PDF - English - BSI
Learn More€180.00 -
IEC TR 61188-8:2021
IEC TR 61188-8:2021 Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library
1/14/2021 - PDF - English - IEC
Learn More€132.00 -
IEEE 370:2020
IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz
1/8/2021 - PDF - English - IEEE
Learn More€152.00 -
IEEE 370:2020
IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz
1/8/2021 - Paper - English - IEEE
Learn More€189.00 -
21/30431274 DC:2021
BS EN 61188-6-3. Circuit boards and circuit board assemblies. Design use Part 6-3. Land pattern design. Description of land for through hole components (THT)
1/6/2021 - PDF - English - BSI
Learn More€24.00 -
20/30419960 DC:2020
BS EN IEC 61189-2-805. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-805. X/Y CTE Thin Base Materials by TMA
12/18/2020 - PDF - English - BSI
Learn More€24.00 -
20/30403517 DC:2020
BS EN IEC 63203-402-2 ED1. Wearable electronic devices and technologies Part 402-2. Performance Measurement of Fitness Wearables. Step Counting
12/15/2020 - PDF - English - BSI
Learn More€24.00 -
BS IEC 62899-202-6:2020
Printed electronics Materials. Conductive ink. Measurement method for resistance changes under high temperature and humidity. conductive layer on a flexible substrate
12/11/2020 - PDF - English - BSI
Learn More€180.00 -
20/30427157 DC:2020
BS IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-808. Thermal resistance of dielectric layer by thermal transient method
12/8/2020 - PDF - English - BSI
Learn More€24.00 -
IEC 62899-202-6:2020
IEC 62899-202-6:2020 Printed electronics - Part 202-6: Materials - Conductive ink - Measurement method for resistance changes under high temperature and humidity - Printed conductive layer on a flexible substrate
12/4/2020 - PDF - English - IEC
Learn More€92.00 -
20/30404286 DC:2020
BS EN IEC 62899-202-9. Materials. Guidelines for printed patterns for mechanical test
11/13/2020 - PDF - English - BSI
Learn More€24.00 -
NF EN IEC 60603-7, C93-430-7 (11/2020)
Connectors for electronic equipment - Part 7 : detail specification for 8-way, unshielded, free and fixed connectors
11/1/2020 - Paper - French - AFNOR
Learn More€170.00 -
IPC 2222B:2020
Sectional Design Standard for Rigid Organic Printed Boards
10/1/2020 - PDF sécurisé - English - IPC
Learn More€157.00 -
IPC 2222B:2020
Sectional Design Standard for Rigid Organic Printed Boards
10/1/2020 - Papier - English - IPC
Learn More€217.00 -
BS IEC 62899-402-2:2020
Printed electronics Printability. Measurement of qualities. Edge waviness
9/4/2020 - PDF - English - BSI
Learn More€180.00 -
IPC WP-019B:2020
White Paper on Global Change in Ionic Cleanliness Requirements
9/1/2020 - PDF sécurisé - English - IPC
Learn More€183.00 -
IPC WP-019B:2020
White Paper on Global Change in Ionic Cleanliness Requirements
9/1/2020 - Papier - English - IPC
Learn More€243.00 -
IEC 62899-402-2:2020
IEC 62899-402-2:2020 Printed electronics - Part 402-2: Printability - Measurement of qualities - Edge waviness
8/21/2020 - PDF - English - IEC
Learn More€92.00 -
UNE-EN IEC 62496-4-214:2020
Optical circuit boards - Part 4-214: Interface standards - Terminated waveguide OCB assembly using a single-row thirty-two-channel symmetric PMT connector (Endorsed by Asociación Española de Normalización in August of 2020.)
8/1/2020 - PDF - English - AENOR
Learn More€68.00 -
IEC 60947-4-3:2020
IEC 60947-4-3:2020 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - Semiconductor controllers and semiconductor contactors for non-motor loads
7/14/2020 - PDF - English - IEC
Learn More€397.00 -
€301.00
-
€387.00
-
UNE-EN IEC 61189-5-504:2020
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (Endorsed by Asociación Española de Normalización in July of 2020.)
7/1/2020 - PDF - English - AENOR
Learn More€72.00 -
BS EN IEC 61189-5-504:2020
Test methods for electrical materials, printed board and other interconnection structures assemblies General test materials assemblies. Process ionic contamination testing (PICT)
6/17/2020 - PDF - English - BSI
Learn More€250.00 -
NF EN IEC 61189-5-504, C93-735-504 (06/2020)
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504 : general test methods for materials and assemblies - Process ionic contamination testing (PICT)
6/1/2020 - Paper - French - AFNOR
Learn More€103.33 -
IPC 6012ES:2020
Space and Military Avionics Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
4/24/2020 - PDF sécurisé - English - IPC
Learn More€108.00 -
IEC 61189-5-504:2020
IEC 61189-5-504:2020 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
4/21/2020 - PDF - English, French - IEC
Learn More€173.00 -
IPC 4101E-WAM1:2020
Specification for Base Materials for Rigid and Multilayer Printed Boards
4/14/2020 - PDF sécurisé - English - IPC
Learn More€195.00 -
€183.00
-
€253.00
-
DIN EN IEC 61188-6-4:2020-04
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019), German version EN IEC 61188-6-4:2019
4/1/2020 - PDF - German - DIN
Learn More€131.96