31.180 : Printed circuits and boards

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  • BS EN IEC 63203-402-2:2024

    Wearable electronic devices and technologies Performance measurement of fitness wearables. Step counting
    3/19/2024 - PDF - English - BSI
    Learn More
    €250.00

  • BS IEC 62899-202-8:2024

    Printed electronics Materials. Conductive ink. Measurement of difference in resistance printing direction conductive film fabricated with wire-shaped materials
    3/19/2024 - PDF - English - BSI
    Learn More
    €180.00

  • 24/30488910 DC:2024

    BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
    3/11/2024 - PDF - English - BSI
    Learn More
    €24.00

  • PD IEC TS 62878-2-10:2024

    Device embedding assembly technology Part 2-10: Design specification for cavity substrate
    2/7/2024 - PDF - English - BSI
    Learn More
    €151.00

  • DIN EN IEC 61249-2-51:2024-02

    Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad (IEC 61249-2-51:2023), German version EN IEC 61249-2-51:2023
    2/1/2024 - PDF - German - DIN
    Learn More
    €92.62

  • IEC TS 62878-2-10:2024

    IEC TS 62878-2-10:2024 Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
    1/31/2024 - PDF - English - IEC
    Learn More
    €46.00

  • 24/30485597 DC:2024

    BS IEC 62899-402-8. Printed electronics Part 402-8. Printability. Measurement of qualities. Shape pattern dimension
    1/9/2024 - PDF - English - BSI
    Learn More
    €24.00

  • PR NF IEC 62878-2-603, C93-778-2-603PR (01/2024)

    Techniques d'assemblage avec appareil(s) intégré(s) - Partie 2-603 : lignes directrices pour un empilement de modules électroniques - Méthode d'essai de la connectivité électrique entre modules
    1/1/2024 - Paper - English, French - AFNOR
    Learn More
    €64.50

  • BS EN IEC 61189-2-801:2023

    Test methods for electrical materials, printed boards and other interconnection structures assemblies Thermal conductivity test base materials
    12/25/2023 - PDF - English - BSI
    Learn More
    €180.00

  • BS EN IEC 61189-2-804:2023

    Test methods for electrical materials, printed board and other interconnection structures assemblies time to delamination. T260, T288, T300
    12/25/2023 - PDF - English - BSI
    Learn More
    €151.00

  • BS EN IEC 63251:2023

    Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
    12/19/2023 - PDF - English - BSI
    Learn More
    €250.00

  • NF EN IEC 63251, C93-737 (12/2023)

    Méthode d'essai des propriétés mécaniques des circuits optoélectriques souples sous contrainte thermique
    12/1/2023 - Paper - French - AFNOR
    Learn More
    €93.50

  • DIN EN IEC 61189-2-501:2023-12

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022), German version EN IEC 61189-2-501:2022
    12/1/2023 - PDF - German - DIN
    Learn More
    €92.62

  • IPC 2221C:2023

    Generic Standard on Printed Board Design
    12/1/2023 - Paper - English - IPC
    Learn More
    €330.00

  • IPC 2221C:2023

    Generic Standard on Printed Board Design
    12/1/2023 - PDF sécurisé - English - IPC
    Learn More
    €230.00

  • BS EN IEC 63203-401-1:2023

    Wearable electronic devices and technologies Devices systems: functional elements. Evaluation method of the stretchable resistive strain sensor
    11/30/2023 - PDF - English - BSI
    Learn More
    €331.00

  • 23/30483578 DC:2023

    BS IEC 62899-202-11. Printed electronics Part 202-11. Materials. Conductive ink. Measurement method of electrical resistance uniformity for large area printed conductive layer
    11/23/2023 - PDF - English - BSI
    Learn More
    €24.00

  • BS IEC 63055:2023

    Format for LSI-Package-Board Interoperable design
    11/8/2023 - PDF - English - BSI
    Learn More
    €449.00

  • UNE-EN IEC 61189-2-804:2023

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (Endorsed by Asociación Española de Normalización in November of 2023.)
    11/3/2023 - PDF - English - AENOR
    Learn More
    €57.00

  • PR NF EN IEC 61188-6-3, C93-711-6-3PR (11/2023)

    Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-3 : Conception de la zone de report - Description de la zone de report pour les composants à trous traversants (THT)
    11/1/2023 - Paper - English, French - AFNOR
    Learn More
    €107.50

  • IEC 63251:2023

    IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
    11/1/2023 - PDF - English, French - IEC
    Learn More
    €173.00

  • BS IEC 62899-202-9:2023

    Printed electronics Materials. Conductive ink. patterns for mechanical test
    10/26/2023 - PDF - English - BSI
    Learn More
    €180.00

  • 23/30436874 DC:2023

    BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity
    10/23/2023 - PDF - English - BSI
    Learn More
    €24.00

  • IEC 63055:2023

    IEC 63055:2023 Format for LSI-Package-Board Interoperable design
    10/11/2023 - PDF - English - IEC
    Learn More
    €489.00

  • UNE-EN IEC 61189-2-801:2023

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (Endorsed by Asociación Española de Normalización in October of 2023.)
    10/6/2023 - PDF - English - AENOR
    Learn More
    €59.00

  • UNE-EN IEC 61189-2-803:2023

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (Endorsed by Asociación Española de Normalización in October of 2023.)
    10/6/2023 - PDF - English - AENOR
    Learn More
    €57.00

  • NF EN IEC 61189-2-804, C93-732-804 (10/2023)

    Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-804 : méthodes d'essai pour le temps de décollement interlaminaire - T260, T288, T300
    10/1/2023 - Paper - French - AFNOR
    Learn More
    €40.33

  • UNE-EN IEC 61249-6-3:2023

    Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards (Endorsed by Asociación Española de Normalización in September of 2023.)
    9/18/2023 - PDF - English - AENOR
    Learn More
    €68.00

  • BS EN IEC 61189-2-803:2023

    Test methods for electrical materials, printed boards and other interconnection structures assemblies Z-axis expansion of base materials
    9/13/2023 - PDF - English - BSI
    Learn More
    €151.00

  • 23/30479769 DC:2023

    BS EN IEC 61249-2-52 Materials for printed boards and other interconnecting structures Part 2-52. Reinforced base materials clad unclad. Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
    9/12/2023 - PDF - English - BSI
    Learn More
    €24.00

  • BS EN IEC 61249-6-3:2023 + Redline

    Tracked Changes. Materials for printed boards and other interconnecting structures Sectional specification set reinforcement materials. Specification finished fabric woven from "E" glass
    9/6/2023 - PDF - English - BSI
    Learn More
    €326.00

  • NF EN IEC 61189-2-801, C93-732-801 (09/2023)

    Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-801 : essai de conductivité thermique pour matériaux de base
    9/1/2023 - Paper - French - AFNOR
    Learn More
    €72.00

  • NF EN IEC 61189-2-803, C93-732-803 (09/2023)

    Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-803 : méthodes d'essai pour la dilatation suivant l'axe Z des matériaux de base et des cartes imprimées
    9/1/2023 - Paper - French - AFNOR
    Learn More
    €72.00

  • IPC 6012F:2023

    Qualification and Performance Specification for Rigid Printed Boards
    9/1/2023 - Papier - English - IPC
    Learn More
    €264.00

  • IPC 6012F:2023

    Qualification and Performance Specification for Rigid Printed Boards
    9/1/2023 - PDF sécurisé - English - IPC
    Learn More
    €204.00

  • IEC 61189-2-804:2023

    IEC 61189-2-804:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
    8/25/2023 - PDF - English, French - IEC
    Learn More
    €23.00

  • BS IEC 62899-202-10:2023

    Printed electronics Materials. Resistance measurement method for thermoformable conducting layer
    8/23/2023 - PDF - English - BSI
    Learn More
    €250.00

  • IEC 62899-202-10:2023

    IEC 62899-202-10:2023 Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
    8/16/2023 - PDF - English - IEC
    Learn More
    €219.00

  • BS EN IEC 61249-6-3:2023

    Materials for printed boards and other interconnecting structures Sectional specification set reinforcement materials. Specification finished fabric woven from "E" glass
    8/8/2023 - PDF - English - BSI
    Learn More
    €250.00

  • IEC 62899-202-9:2023

    IEC 62899-202-9:2023 Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
    8/3/2023 - PDF - English - IEC
    Learn More
    €92.00

  • 23/30477815 DC:2023

    BS IEC 62899-302-7. Printed electronics Part 302-7. Equipment. Measurement methods for Inkjet printing dot placement evaluation printed
    8/2/2023 - PDF - English - BSI
    Learn More
    €24.00

  • NF EN IEC 61249-6-3, C93-780-6-3 (08/2023)

    Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 6-3 : ensemble de spécifications intermédiaires pour matériaux de renfort - Spécification des tissus finis en verre "E" pour circuits imprimés
    8/1/2023 - Paper - French - AFNOR
    Learn More
    €88.33

  • UNE-EN IEC 61249-2-51:2023

    Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (Endorsed by Asociación Española de Normalización in July of 2023.)
    7/26/2023 - PDF - English - AENOR
    Learn More
    €65.00

  • IEC 61189-2-801:2023

    IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
    7/26/2023 - PDF - English, French - IEC
    Learn More
    €46.00

  • IEC 61189-2-803:2023

    IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
    7/26/2023 - PDF - English, French - IEC
    Learn More
    €23.00

  • DIN EN IEC 62878-2-603:2023-07

    Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022), Text in German and English
    7/1/2023 - PDF - English, German - DIN
    Learn More
    €79.72

  • CWA 18002:2023

    Best practices for hybridization and injection moulding of rigid control units on in-mould flexible devices
    6/22/2023 - PDF - English - NBN
    Learn More
    €121.00

  • BS EN IEC 61249-2-51:2023

    Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Base materials integrated circuit card carrier tape, unclad
    6/22/2023 - PDF - English - BSI
    Learn More
    €180.00

  • PD IEC TR 61191-9:2023

    Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit for use in automotive applications. Best practices
    6/19/2023 - PDF - English - BSI
    Learn More
    €377.00

  • IEC 61249-6-3:2023

    IEC 61249-6-3:2023 Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
    6/14/2023 - PDF - English, French - IEC
    Learn More
    €173.00

  • BS IEC 62899-202:2023 + Redline

    Tracked Changes. Printed electronics Materials. Conductive ink
    6/8/2023 - PDF - English - BSI
    Learn More
    €382.00

  • IEC TR 61191-9:2023

    IEC TR 61191-9:2023 Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
    6/7/2023 - PDF - English - IEC
    Learn More
    €397.00

  • 23/30474639 DC:2023

    BS EN IEC 62899-402-1. Printed electronics Part 402-1. Printability. Measurement of qualities. Line pattern widths
    6/2/2023 - PDF - English - BSI
    Learn More
    €24.00

  • NF EN IEC 61249-2-51, C93-780-2-51 (06/2023)

    Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-51 : matériaux de base renforcés, plaqués et non plaqués - Matériaux de base pour bande support de carte à circuit intégré, non plaqués
    6/1/2023 - Paper - French - AFNOR
    Learn More
    €88.33

  • IEEE 2716:2022

    IEEE Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding
    5/29/2023 - PDF - English - IEEE
    Learn More
    €66.00

  • IEEE 2716:2022

    IEEE Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding
    5/29/2023 - Paper - English - IEEE
    Learn More
    €82.00

  • 23/30473810 DC:2023

    BS IEC 63240-1. Active assisted living (AAL) reference architecture and model Part 1. Reference
    5/26/2023 - PDF - English - BSI
    Learn More
    €24.00

  • 23/30474274 DC:2023

    BS EN IEC 63267-3-81. Fibre optic interconnecting devices and passive components. Connector optical interfaces for enhanced Macro bend multimode fibre Part 3-81. parameters of physically contacting 50 µm core diameter fibres. Non-angled polyphenylene sulphide rectangular ferrules with a single row 12, 8, 4, or 2 fibres reference connector applications
    5/26/2023 - PDF - English - BSI
    Learn More
    €24.00

  • 23/30474278 DC:2023

    BS EN IEC 63267-3-61. Fibre optic interconnecting devices and passive components. connector optical interfaces for enhanced macrobend multimode fibres Part 3-61. Connector parameters of physically contacting 50 µm core diameter fibres. Non-angled 2,5 mm 1,25 cylindrical full zirconia ferrules reference connection applications
    5/26/2023 - PDF - English - BSI
    Learn More
    €24.00

  • BS IEC 62899-202:2023

    Printed electronics Materials. Conductive ink
    5/25/2023 - PDF - English - BSI
    Learn More
    €293.00

  • IEC 61249-2-51:2023

    IEC 61249-2-51:2023 Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
    5/11/2023 - PDF - English, French - IEC
    Learn More
    €132.00

  • IEC 62899-202:2023

    IEC 62899-202:2023 Printed electronics - Part 202: Materials - Conductive ink
    5/2/2023 - PDF - English - IEC
    Learn More
    €270.00

  • IEC 62899-202:2023 + Redline

    IEC 62899-202:2023 (Redline version) Printed electronics - Part 202: Materials - Conductive ink
    5/2/2023 - PDF - English - IEC
    Learn More
    €352.00

  • IPC 9797A:2023

    Press-fit Standard for Automotive Requirements and other High-Reliability Applications
    5/1/2023 - Papier - English - IPC
    Learn More
    €242.00

  • IPC 9797A:2023

    Press-fit Standard for Automotive Requirements and other High-Reliability Applications
    5/1/2023 - PDF sécurisé - English - IPC
    Learn More
    €182.00

  • PR NF EN IEC 61189-2-720, C93-732-720PR (04/2023)

    Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-720 : détection de défauts présents dans les structures d'interconnexion par mesurage de la capacité
    4/1/2023 - Paper - English, French - AFNOR
    Learn More
    €64.50

  • PR NF EN IEC 61189-2-808, C93-732-808PR (04/2023)

    Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures et assemblages d'interconnexion - Partie 2-808 : résistance thermique d'un assemblage par la méthode du transitoire thermique
    4/1/2023 - Paper - English, French - AFNOR
    Learn More
    €80.50

  • DIN EN IEC 61188-6-2:2023-03

    Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021), German version EN IEC 61188-6-2:2021
    3/1/2023 - PDF - German - DIN
    Learn More
    €110.00

  • BS EN IEC 63203-801-1:2022

    Wearable electronic devices and technologies Smart body area network (SmartBAN). Enhanced ultra-low power physical layer
    2/7/2023 - PDF - English - BSI
    Learn More
    €180.00

  • BS EN IEC 62496-2-5:2022

    Optical circuit boards. Basic test and measurement procedures Flexibility for flexible opto-electric circuits
    1/26/2023 - PDF - English - BSI
    Learn More
    €250.00

  • BS EN IEC 63203-402-1:2022

    Wearable electronic devices and technologies Performance measurement of fitness wearables. Test methods glove-type motion sensors for measuring finger movements
    1/20/2023 - PDF - English - BSI
    Learn More
    €250.00

  • 23/30445197 DC:2023

    BS EN 62899-401. Printed electronics Part 401. Printability. Overview
    1/16/2023 - PDF - English - BSI
    Learn More
    €24.00

  • DIN EN IEC 61189-2-807:2023-01

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021), German version EN IEC 61189-2-807:2021
    1/1/2023 - PDF - German - DIN
    Learn More
    €72.80

  • 22/30453836 DC:2022

    BS EN 60194-2. Printed boards design, manufacture and assembly. Vocabulary Part 2. Common usage in electronic technologies as well printed board assembly
    12/16/2022 - PDF - English - BSI
    Learn More
    €24.00

  • DIN EN IEC 61189-5-601:2022-12

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 61189-5-601:2021), German version EN IEC 61189-5-601:2021
    12/1/2022 - PDF - German - DIN
    Learn More
    €131.96

  • UNE-EN IEC 62496-2-5:2023

    Optical circuit boards - Basic test and measurement procedures - Part 2-5: Flexibility test for flexible opto-electric circuits (Endorsed by Asociación Española de Normalización in March of 2023.)
    10/12/2022 - PDF - English - AENOR
    Learn More
    €69.00

  • PR NF EN IEC 61189-2-809, C93-732-809PR (10/2022)

    Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-809 : Essai du coefficient de dilatation thermique (CTE) X/Y pour matériaux de base épais à l'aide d'un analyseur thermomécanique (TMA)
    10/1/2022 - Paper - English, French - AFNOR
    Learn More
    €56.00

  • IPC J-STD-003D:2022

    Solderability Tests for Printed Boards
    10/1/2022 - PDF sécurisé - English - IPC
    Learn More
    €194.00

  • PD IEC PAS 61191-10:2022

    Printed board assemblies Application and utilization of protective coatings for electronic
    9/13/2022 - PDF - English - BSI
    Learn More
    €449.00

  • DIN EN IEC 61189-2-720:2022-09

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 91/1786/CD:2022), Text in German and English
    9/1/2022 - PDF - English, German - DIN
    Learn More
    €65.89

  • PD IEC TR 62878-2-9:2022

    Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic industries
    8/23/2022 - PDF - English - BSI
    Learn More
    €180.00

  • DIN EN IEC 61189-5-301:2022-08

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (IEC 61189-5-301:2021), German version EN IEC 61189-5-301:2021
    8/1/2022 - PDF - German - DIN
    Learn More
    €120.84

  • DIN EN IEC 61189-5-501:2022-08

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (IEC 61189-5-501:2021), German version EN IEC 61189-5-501:2021
    8/1/2022 - PDF - German - DIN
    Learn More
    €104.95

  • DIN EN IEC 62878-2-602:2022-08

    Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 62878-2-602:2021), German version EN IEC 62878-2-602:2021
    8/1/2022 - PDF - German - DIN
    Learn More
    €79.72

  • DIN EN IEC 61188-6-1:2022-08

    Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021), German version EN IEC 61188-6-1:2021.
    8/1/2022 - PDF - German - DIN
    Learn More
    €115.33

  • IEC PAS 61191-10:2022

    IEC PAS 61191-10:2022 Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
    7/18/2022 - PDF - English - IEC
    Learn More
    €489.00

  • 22/30442107 DC:2022

    Printed Electronics Part 507-1. Quality assessment. electrode and rivet connection to wire terminal
    6/17/2022 - PDF - English - BSI
    Learn More
    €24.00

  • BS EN IEC 63203-406-1:2022

    Wearable electronic devices and technologies Test method for measuring surface temperature of wrist-worn wearable while in contact with human skin (IEC 63203-406-1:2021)
    5/10/2022 - PDF - English - BSI
    Learn More
    €180.00

  • BS EN IEC 61189-2-501:2022

    Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Measurement of resilience strength retention factor flexible dielectric
    5/6/2022 - PDF - English - BSI
    Learn More
    €250.00

  • DIN EN IEC 61189-5-502:2022-05

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021), German version EN IEC 61189-5-502:2021
    5/1/2022 - PDF - German - DIN
    Learn More
    €104.95

  • 22/30455094 DC:2022

    BS EN 61189-2-720. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-720. Detection of defects in by measurement capacitance
    4/30/2022 - PDF - English - BSI
    Learn More
    €24.00

  • IEC TR 62878-2-9:2022

    IEC TR 62878-2-9:2022 Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
    4/27/2022 - PDF - English - IEC
    Learn More
    €92.00

  • BS IEC 62899-201-2:2021

    Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates
    4/6/2022 - PDF - English - BSI
    Learn More
    €151.00

  • DIN EN IEC 61188-6-3:2022-04

    Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021), Text in German and English
    4/1/2022 - PDF - English, German - DIN
    Learn More
    €99.35

  • UNE-EN IEC 61189-2-501:2022

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (Endorsed by Asociación Española de Normalización in April of 2022.)
    4/1/2022 - PDF - English - AENOR
    Learn More
    €65.00

  • ASTM D3380-22

    Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
    3/15/2022 - PDF - English - ASTM
    Learn More
    €57.00

  • ASTM D3380-22 + Redline

    Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
    3/15/2022 - PDF - English - ASTM
    Learn More
    €68.00

  • NF EN IEC 61189-2-501, C93-732-501 (03/2022)

    Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-501 : méthodes d'essai des matériaux pour structures d'interconnexion - Mesure de la puissance élastique et du facteur de rétention de la puissance élastique des matériaux diélectriques flexibles
    3/1/2022 - Paper - French - AFNOR
    Learn More
    €88.33

  • DIN EN IEC 61189-2-805:2022-03

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020), Text in German and English
    3/1/2022 - PDF - English, German - DIN
    Learn More
    €59.63

  • DIN EN IEC 61189-2-808:2022-03

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020), Text in German and English
    3/1/2022 - PDF - English, German - DIN
    Learn More
    €92.62

  • DIN EN IEC 61189-2-809:2022-03

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021), Text in German and English
    3/1/2022 - PDF - English, German - DIN
    Learn More
    €59.63

  • IPC 7526A:2022

    Stencil and Misprinted Board Cleaning Handbook
    3/1/2022 - PDF sécurisé - English - IPC
    Learn More
    €183.00

  • IPC 7526A:2022

    Stencil and Misprinted Board Cleaning Handbook
    3/1/2022 - Paper - English - IPC
    Learn More
    €243.00

  • IPC 6012E-AM1:2022

    IPC-6012E-AM1: Qualification and Performance Specification for Rigid Printed Boards
    3/1/2022 - PDF sécurisé - English - IPC
    Learn More
    €24.00

  • IEC 61189-2-501:2022

    IEC 61189-2-501:2022 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
    2/3/2022 - PDF - English, French - IEC
    Learn More
    €92.00

  • IPC 6018D:2022

    Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
    2/1/2022 - PDF sécurisé - English - IPC
    Learn More
    €195.00

  • PR NF EN IEC 61189-2-805, C93-732-805PR (01/2022)

    Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-805 : essai à faible CDT X/Y par TMA pour matériaux de base minces
    1/1/2022 - Paper - English, French - AFNOR
    Learn More
    €56.00

  • IPC-QRG-DRM-PTH - Revision H - Training & Reference Guide

    Through-Hole Solder Joint Evaluation Training & Reference Guide - English
    1/1/2022 - Paper - English - IPC
    Learn More
    €107.00

  • IPC-QRG-SMT - Revision H - Training & Reference Guide

    Surface Mount Solder Joint Evaluation Training & Reference Guide -English
    1/1/2022 - Paper - English - IPC
    Learn More
    €106.80

  • IPC 4202C:2022

    Specification for Flexible Base Dielectrics for Use in Flexible Printed Boards
    1/1/2022 - PDF sécurisé - English - IPC
    Learn More
    €100.00

  • IPC 4202C:2022

    Specification for Flexible Base Dielectrics for Use in Flexible Printed Boards
    1/1/2022 - Paper - English - IPC
    Learn More
    €142.00

  • BS IEC 62899-202-4:2021

    Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
    12/24/2021 - PDF - English - BSI
    Learn More
    €250.00

  • 21/30434810 DC:2021

    BS EN IEC 62899-202-8. Printed electronics Part 202-8. Materials. Conductive film. Measurement for difference in resistance with printing direction of conductive film fabricated wire shaped materials
    12/17/2021 - PDF - English - BSI
    Learn More
    €24.00

  • 21/30432230 DC:2021

    BS EN IEC 63203-402-3. Wearable electronic devices and technologies Part 402-3. Performance measurement method of wearables. Series 2: Accuracy Heart Rate Determination
    11/19/2021 - PDF - English - BSI
    Learn More
    €24.00

  • 21/30447898 DC:2021

    BS EN IEC 63203-402-2. Wearable electronic devices and technologies Part 402-2. Performance Measurement of Fitness Wearables. Step Counting
    11/19/2021 - PDF - English - BSI
    Learn More
    €24.00

  • BS EN IEC 61189-2-807:2021

    Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Decomposition temperature (Td) using TGA
    11/5/2021 - PDF - English - BSI
    Learn More
    €151.00

  • 21/30437997 DC:2021

    BS EN IEC 62899-202-10. Printed Electronics Part 202-10. Materials. Resistance measurement method for thermoformable conducting layers
    11/5/2021 - PDF - English - BSI
    Learn More
    €24.00

  • UNE-EN IEC 61189-2-807:2021

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (Endorsed by Asociación Española de Normalización in November of 2021.)
    11/1/2021 - PDF - English - AENOR
    Learn More
    €60.00

  • PD IEC TR 62899-402-4:2021

    Printed electronics Printability. Measurement of qualities. Classification and measurement methods for morphology
    10/29/2021 - PDF - English - BSI
    Learn More
    €180.00

  • 21/30446636 DC:2021

    BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-808. Thermal resistance of an assembly by thermal transient method
    10/29/2021 - PDF - English - BSI
    Learn More
    €24.00

  • IEC 62899-202-4:2021

    IEC 62899-202-4:2021 Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)
    10/22/2021 - PDF - English - IEC
    Learn More
    €173.00

  • IEC 62899-201-2:2021

    IEC 62899-201-2:2021 Printed electronics - Part 201-2: Materials - Substrates - Measurement methods for properties of stretchable substrates
    10/14/2021 - PDF - English - IEC
    Learn More
    €46.00

  • DIN EN IEC 62878-1:2021-10

    Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019), German version EN IEC 62878-1:2019
    10/1/2021 - PDF - German - DIN
    Learn More
    €99.35

  • UNE-EN IEC 62878-2-602:2021

    Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (Endorsed by Asociación Española de Normalización in October of 2021.)
    10/1/2021 - PDF - English - AENOR
    Learn More
    €63.00

  • NF EN IEC 61189-2-807, C93-732-807 (10/2021)

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807 : Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA
    10/1/2021 - Paper - French - AFNOR
    Learn More
    €72.00

  • IPC 6012EA:2021

    Automotive Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
    10/1/2021 - PDF sécurisé - English - IPC
    Learn More
    €58.00

  • IEC TR 62899-402-4:2021

    IEC TR 62899-402-4:2021 Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology
    9/21/2021 - PDF - English - IEC
    Learn More
    €132.00

  • IEC 61189-2-807:2021

    IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
    9/3/2021 - PDF - English, French - IEC
    Learn More
    €46.00

  • IPC 6013E:2021

    Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
    9/1/2021 - PDF sécurisé - English - IPC
    Learn More
    €195.00

  • DIN EN IEC 61189-5-504:2021-09

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (IEC 61189-5-504:2020), German version EN IEC 61189-5-504:2020
    9/1/2021 - PDF - German - DIN
    Learn More
    €104.95

  • BS EN IEC 62878-2-602:2021

    Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
    8/20/2021 - PDF - English - BSI
    Learn More
    €180.00

  • NF EN IEC 62878-2-602, C93-778-2-602 (08/2021)

    Techniques d'assemblage avec appareil(s) intégré(s) - Partie 2-602 : lignes directrices pour un empilement de modules électroniques - Méthode d'évaluation de la connectivité électrique entre modules
    8/1/2021 - Paper - French - AFNOR
    Learn More
    €88.33

  • 21/30441791 DC:2021

    BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-809. X/Y Coefficient of Thermal Expansion (CTE) Thick Base Materials by TMA
    7/30/2021 - PDF - English - BSI
    Learn More
    €24.00

  • PD IEC TR 62878-2-8:2021

    Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
    7/29/2021 - PDF - English - BSI
    Learn More
    €180.00

  • IPC 4552B:2021

    Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
    7/27/2021 - PDF sécurisé - English - IPC
    Learn More
    €231.00

  • IEC TR 62878-2-8:2021

    IEC TR 62878-2-8:2021 Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
    7/7/2021 - PDF - English - IEC
    Learn More
    €92.00

  • IEC 62878-2-602:2021

    IEC 62878-2-602:2021 Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
    6/22/2021 - PDF - English, French - IEC
    Learn More
    €92.00

  • NF EN IEC 61189-5-601, C93-735-601 (06/2021)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601 : general test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards - Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-601 : méthodes d'essai générales pour les matériaux et les assemblages - Essai d'aptitude au brasage par refusion pour un joint brasé, et essai de résistance
    6/1/2021 - Paper - French - AFNOR
    Learn More
    €127.67

  • NF EN IEC 61189-5-502, C93-735-502 (06/2021)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502 : General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies - Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-502 : Méthodes d'essai générales pour les matériaux et les ensembles - Essai de résistance d'isolement de surface (SIR) des ensembles.
    6/1/2021 - Paper - French - AFNOR
    Learn More
    €103.33

  • UNE-EN IEC 61189-5-301:2021

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (Endorsed by Asociación Española de Normalización in June of 2021.)
    6/1/2021 - PDF - English - AENOR
    Learn More
    €75.00

  • BS EN IEC 61189-5-301:2021

    Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Soldering paste using fine solder particles
    5/6/2021 - PDF - English - BSI
    Learn More
    €293.00

  • UNE-EN IEC 61188-6-1:2021

    Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)
    5/1/2021 - PDF - English - AENOR
    Learn More
    €75.00

  • BS IEC 62899-402-3:2021

    Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
    4/22/2021 - PDF - English - BSI
    Learn More
    €180.00

  • BS EN IEC 61188-6-1:2021

    Circuit boards and circuit board assemblies. Design use Land pattern design. Generic requirements for land on
    4/7/2021 - PDF - English - BSI
    Learn More
    €293.00

  • IEC 62899-402-3:2021

    IEC 62899-402-3:2021 Printed electronics - Part 402-3: Printability - Measurement of qualities - Voids in printed pattern using a two-dimensional optical image
    4/7/2021 - PDF - English - IEC
    Learn More
    €132.00

  • NF EN IEC 61188-6-1, C93-711-6-1 (04/2021)

    Circuit boards and circuit board assemblies - Design and use - Part 6-1 : land pattern design - Generic requirements for land pattern on circuit boards - Cartes à circuit imprimé et cartes à circuit imprimé équipées - Conception et utilisation - Partie 6-1 : Conception de la zone de report - Exigences génériques pour la zone de report sur les cartes à circuit imprimé
    4/1/2021 - Paper - French - AFNOR
    Learn More
    €116.33

  • NF EN IEC 61189-5-301, C93-735-301 (04/2021)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301 : general test methods for materials and assemblies - Soldering paste using fine solder particles - Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-301 : Méthodes d'essai pour les cartes imprimées équipées - Pâte à braser à fines particules de brasage.
    4/1/2021 - Paper - French - AFNOR
    Learn More
    €116.33

  • DIN EN IEC 62878-2-5:2021-04

    Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (IEC 62878-2-5:2019), German version EN IEC 62878-2-5:2019
    4/1/2021 - PDF - German - DIN
    Learn More
    €148.04

  • UNE-EN IEC 61189-5-501:2021

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (Endorsed by Asociación Española de Normalización in April of 2021.)
    4/1/2021 - PDF - English - AENOR
    Learn More
    €69.00

  • UNE-EN IEC 61188-6-2:2021

    Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (Endorsed by Asociación Española de Normalización in April of 2021.)
    4/1/2021 - PDF - English - AENOR
    Learn More
    €72.00

  • UNE-EN IEC 61189-5-502:2021

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (Endorsed by Asociación Española de Normalización in April of 2021.)
    4/1/2021 - PDF - English - AENOR
    Learn More
    €71.00

  • UNE-EN IEC 61189-5-601:2021

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (Endorsed by Asociación Española de Normalización in April of 2021.)
    4/1/2021 - PDF - English - AENOR
    Learn More
    €83.00

  • PD IEC TR 61191-8:2021

    Printed board assemblies Voiding in solder joints of printed for use automotive electronic control units. Best practices
    3/25/2021 - PDF - English - BSI
    Learn More
    €293.00

  • BS EN IEC 61189-5-601:2021

    Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Reflow soldering ability solder joint, reflow heat resistance
    3/19/2021 - PDF - English - BSI
    Learn More
    €331.00

  • BS EN IEC 61188-6-2:2021

    Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for the most common surface mounted components (SMD)
    3/19/2021 - PDF - English - BSI
    Learn More
    €250.00

  • IEC TR 61191-8:2021

    IEC TR 61191-8:2021 Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
    3/19/2021 - PDF - English - IEC
    Learn More
    €270.00

  • BS EN IEC 61189-5-502:2021

    Test methods for electrical materials, printed board and other interconnection structures assemblies General test materials assemblies. Surface insulation resistance (SIR) testing of
    3/18/2021 - PDF - English - BSI
    Learn More
    €250.00

  • IEC 61189-5-301:2021

    IEC 61189-5-301:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
    3/17/2021 - PDF - English, French - IEC
    Learn More
    €270.00

  • BS EN IEC 61189-5-501:2021

    Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Surface insulation resistance (SIR) testing of solder fluxes
    3/12/2021 - PDF - English - BSI
    Learn More
    €250.00

  • BS IEC 62899-202-7:2021

    Printed electronics Materials. film. Measurement of peel strength for printed layer on flexible substrate by the 90° method
    3/11/2021 - PDF - English - BSI
    Learn More
    €180.00

  • IEC 62899-202-7:2021

    IEC 62899-202-7:2021 Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method
    3/3/2021 - PDF - English - IEC
    Learn More
    €92.00

  • NF EN IEC 61189-5-501, C93-735-501 (03/2021)

    Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-501 : méthodes d'essai générales pour les matériaux et les ensembles - Essais de résistance d'isolement en surface (RIS) des flux de brasage
    3/1/2021 - Paper - French - AFNOR
    Learn More
    €103.33

  • NF EN IEC 61188-6-2, C93-711-6-2 (03/2021)

    Printed boards and printed board assemblies - Design and use - Part 6-2 : land pattern design - Description of land pattern for the most common surface mounted components (SMD) - Cartes à circuit imprimé et cartes à circuit imprimé équipées - Conception et utilisation - Partie 6-2 : conception de la zone de report - Description de la zone de report pour les composants montés en surface (CMS) les plus courants
    3/1/2021 - Paper - French - AFNOR
    Learn More
    €88.33

  • IEC 61188-6-1:2021

    IEC 61188-6-1:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
    2/23/2021 - PDF - English, French - IEC
    Learn More
    €270.00

  • IEC 60194-1:2021

    IEC 60194-1:2021 Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
    2/9/2021 - PDF - English, French - IEC
    Learn More
    €489.00

  • IEC 61188-6-2:2021

    IEC 61188-6-2:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
    2/4/2021 - PDF - English, French - IEC
    Learn More
    €173.00

  • IEC 61189-5-502:2021

    IEC 61189-5-502:2021 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies
    2/3/2021 - PDF - English, French - IEC
    Learn More
    €173.00

  • IEC 61189-5-601:2021

    IEC 61189-5-601:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
    2/3/2021 - PDF - English, French - IEC
    Learn More
    €270.00

  • IEC 61189-5-501:2021

    IEC 61189-5-501:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
    1/26/2021 - PDF - English, French - IEC
    Learn More
    €132.00

  • PD IEC TR 61188-8:2021

    Circuit boards and circuit board assemblies. Design use 3D shape data for CAD component library
    1/22/2021 - PDF - English - BSI
    Learn More
    €180.00

  • IEC TR 61188-8:2021

    IEC TR 61188-8:2021 Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library
    1/14/2021 - PDF - English - IEC
    Learn More
    €132.00

  • IEEE 370:2020

    IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz
    1/8/2021 - PDF - English - IEEE
    Learn More
    €152.00

  • IEEE 370:2020

    IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz
    1/8/2021 - Paper - English - IEEE
    Learn More
    €189.00

  • 21/30431274 DC:2021

    BS EN 61188-6-3. Circuit boards and circuit board assemblies. Design use Part 6-3. Land pattern design. Description of land for through hole components (THT)
    1/6/2021 - PDF - English - BSI
    Learn More
    €24.00

  • 20/30419960 DC:2020

    BS EN IEC 61189-2-805. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-805. X/Y CTE Thin Base Materials by TMA
    12/18/2020 - PDF - English - BSI
    Learn More
    €24.00

  • 20/30403517 DC:2020

    BS EN IEC 63203-402-2 ED1. Wearable electronic devices and technologies Part 402-2. Performance Measurement of Fitness Wearables. Step Counting
    12/15/2020 - PDF - English - BSI
    Learn More
    €24.00

  • BS IEC 62899-202-6:2020

    Printed electronics Materials. Conductive ink. Measurement method for resistance changes under high temperature and humidity. conductive layer on a flexible substrate
    12/11/2020 - PDF - English - BSI
    Learn More
    €180.00

  • 20/30427157 DC:2020

    BS IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-808. Thermal resistance of dielectric layer by thermal transient method
    12/8/2020 - PDF - English - BSI
    Learn More
    €24.00

  • IEC 62899-202-6:2020

    IEC 62899-202-6:2020 Printed electronics - Part 202-6: Materials - Conductive ink - Measurement method for resistance changes under high temperature and humidity - Printed conductive layer on a flexible substrate
    12/4/2020 - PDF - English - IEC
    Learn More
    €92.00

  • 20/30404286 DC:2020

    BS EN IEC 62899-202-9. Materials. Guidelines for printed patterns for mechanical test
    11/13/2020 - PDF - English - BSI
    Learn More
    €24.00

  • NF EN IEC 60603-7, C93-430-7 (11/2020)

    Connectors for electronic equipment - Part 7 : detail specification for 8-way, unshielded, free and fixed connectors
    11/1/2020 - Paper - French - AFNOR
    Learn More
    €170.00

  • IPC 2222B:2020

    Sectional Design Standard for Rigid Organic Printed Boards
    10/1/2020 - PDF sécurisé - English - IPC
    Learn More
    €157.00

  • IPC 2222B:2020

    Sectional Design Standard for Rigid Organic Printed Boards
    10/1/2020 - Papier - English - IPC
    Learn More
    €217.00

  • BS IEC 62899-402-2:2020

    Printed electronics Printability. Measurement of qualities. Edge waviness
    9/4/2020 - PDF - English - BSI
    Learn More
    €180.00

  • IPC WP-019B:2020

    White Paper on Global Change in Ionic Cleanliness Requirements
    9/1/2020 - PDF sécurisé - English - IPC
    Learn More
    €183.00

  • IPC WP-019B:2020

    White Paper on Global Change in Ionic Cleanliness Requirements
    9/1/2020 - Papier - English - IPC
    Learn More
    €243.00

  • IEC 62899-402-2:2020

    IEC 62899-402-2:2020 Printed electronics - Part 402-2: Printability - Measurement of qualities - Edge waviness
    8/21/2020 - PDF - English - IEC
    Learn More
    €92.00

  • UNE-EN IEC 62496-4-214:2020

    Optical circuit boards - Part 4-214: Interface standards - Terminated waveguide OCB assembly using a single-row thirty-two-channel symmetric PMT connector (Endorsed by Asociación Española de Normalización in August of 2020.)
    8/1/2020 - PDF - English - AENOR
    Learn More
    €68.00

  • IEC 60947-4-3:2020

    IEC 60947-4-3:2020 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - Semiconductor controllers and semiconductor contactors for non-motor loads
    7/14/2020 - PDF - English - IEC
    Learn More
    €397.00

  • IPC A-600K:2020

    Acceptability of Printed Boards
    7/9/2020 - PDF sécurisé - English - IPC
    Learn More
    €301.00

  • IPC A-600K:2020

    Acceptability of Printed Boards
    7/9/2020 - Paper - English - IPC
    Learn More
    €387.00

  • UNE-EN IEC 61189-5-504:2020

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (Endorsed by Asociación Española de Normalización in July of 2020.)
    7/1/2020 - PDF - English - AENOR
    Learn More
    €72.00

  • BS EN IEC 61189-5-504:2020

    Test methods for electrical materials, printed board and other interconnection structures assemblies General test materials assemblies. Process ionic contamination testing (PICT)
    6/17/2020 - PDF - English - BSI
    Learn More
    €250.00

  • NF EN IEC 61189-5-504, C93-735-504 (06/2020)

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504 : general test methods for materials and assemblies - Process ionic contamination testing (PICT)
    6/1/2020 - Paper - French - AFNOR
    Learn More
    €103.33

  • IPC 6012ES:2020

    Space and Military Avionics Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
    4/24/2020 - PDF sécurisé - English - IPC
    Learn More
    €108.00

  • IEC 61189-5-504:2020

    IEC 61189-5-504:2020 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
    4/21/2020 - PDF - English, French - IEC
    Learn More
    €173.00

  • IPC 4101E-WAM1:2020

    Specification for Base Materials for Rigid and Multilayer Printed Boards
    4/14/2020 - PDF sécurisé - English - IPC
    Learn More
    €195.00

  • IPC 1602:2020

    Standard for Printed Board Handling and Storage
    4/7/2020 - PDF sécurisé - English - IPC
    Learn More
    €183.00

  • IPC 1602:2020

    Standard for Printed Board Handling and Storage
    4/7/2020 - Paper - English - IPC
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    €253.00

  • DIN EN IEC 61188-6-4:2020-04

    Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019), German version EN IEC 61188-6-4:2019
    4/1/2020 - PDF - German - DIN
    Learn More
    €131.96

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